ASSMANN WSW: Thermal interface material (TIM) for heat sink applications

Whether thermal paste or foil: TIM from ASSMANN WSW ensures efficient heat transfer. Order the new products now from GUDECO!

When heat is generated in electronic applications, components that ensure stable and efficient heat dissipation are essential. Our long-standing manufacturing partner ASSMANN WSW offers a wide range of thermal interface materials (TIM) for this purpose. These are ideal for applications in industry, medical technology, household appliances, and automotive.

Thermal paste: For optimal contact surfaces
ASSMANN WSW thermal interface materials minimize air pockets, thereby reducing thermal resistance between semiconductors and heat sinks. They are available in silicone-containing and silicone-free versions, tailored to different areas of application.

Thermal interface materials: Efficient and versatile
In addition to pastes, ASSMANN WSW also offers thermal interface films with a conductivity of up to 15 W/mK. The films are electrically insulating and can be equipped with an additional adhesive layer or glass fiber reinforcement for robust applications upon request. Customized cuts are also available from the manufacturer.

Typical advantages of TIM solutions:

• High thermal conductivity for reliable thermal management 
• Reduced thermal resistance for longer component life 
• Versatile designs: paste or film 
• Electrically insulating properties Ideal for LED applications, e.g., industrial PCs or automation technology

Buy TIM material from ASSMANN WSW online. At GUDECO.
From thermal paste for series production to custom-cut films: order innovative thermal interface materials directly from the GUDECO online shop. We are happy to assist you in selecting the optimal products for your project.